○ Semiconductor manufacturing plant Fab, handling container for chip manufacturing in the plant
○ 3S FOUP has the characteristics of light weight and humanized design
○ Use conductive materials to prevent particle adsorption due to static electricity
○ Semiconductor manufacturing plant Fab, handling container for chip manufacturing in the plant
○ 3S FOUP has the characteristics of light weight and humanized design
○ Use conductive materials to prevent particle adsorption due to static electricity
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3S FOUP |
|---|---|
| Capacity | 25 pieces |
| Pitch (PITCH) | 10mm |
| Dimensions | W419mm X D343mm X H336mm |
| weight | 4.2kg (excluding wafers)-7.2kg (including wafer) ,Weight depend on optional features |
