○ High precision metrology
○ Flexible product adaptation near customer
○ Best cost benefit ratio compared to competitors
○ Long term customer’s care and product support
E+H Measuring sorting system |
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---|---|---|
Technical Specifications |
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Wafer diameter |
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300mm |
Thickness range |
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600-900µm |
Max. Warp |
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100µm |
Resistivity range |
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0.001-200Ohm•cm |
Type check range |
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0.020-200Ohm•cm |
Thickness Measurement |
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Thickness absolute Accuracy |
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+/-0.3µm |
TTV Accuracy (MX 6012) |
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+/-0.1µm |
Precision (MX 6012) |
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0.05µm(1 Sigma) |
Resistivity Measurement |
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Accuracy | 0.001-80 Ω•cm | +/-1% |
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80-200Ω•cm | +/-5% |
Precision | 0.001-80Ω•cm | 0.2%(1 Sigma) |
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80-200Ω•cm | 2%(1 Sigma) |
Edge Exclusion |
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Thickness |
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5 mm |
Resistivity |
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10 mm |
Throughput (1 Point) |
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> 150 Wafer/hour |
Station |
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12 |
1、Deviation of real value, average of repeated measurements are within these limits, at calibration temperature +/- 2 K, gradient < 1 K/h
2、Distance from sensor center to wafer edge
3、Depends on quality of calibration samples