• AGS

    AGS


    Improve Uniformity and Yield with the Wireless WaferSense AGS for Accurate and Repeatable Setups Speeds non-contact gap measurements and parallelism adjustments under vacuum for semiconductor processes such as thin-film deposition, sputtering and etch.
    Achieve the ideal set-up for your equipment by measuring gaps at three points.
    With the easy-to-use GapView™ and GapReview™ software.Achieve the best uniformity, whether you need to set a gap that is perfectly parallel or slightly tilted.


    • Features and Advantages
    • Specifications
    • Applications

    ◆ Characteristic


    ○ Available in 200mm, 300mm and 450mm

    ○ GapView: Displays real-time numerical and graphical data. Easily identify if it is above, below or within the target gap range.

    ○ GapReview: Replays log file data for review and analysis.


    AGS
    Durable housing Anodized aluminum (200 & 300mm), Carbon fiber composite (450mm)
    Lightweight 225 grams (200mm), 400 grams (300mm), 750 grams (450mm)
    Gap accuracy W387mm X D344.5mm X H328mm
    Operating pressure <10e-6 to 760 torr
    Operating temperature 20 to 70 degrees C
    Battery-operation >4 hrs. per charge, 8 hrs. typical
    WaferSense Link Bluetooth, 2.4 GHz, USB 1.1, dimensions 92mm x 58mm x 28mm
    Operating Systems Windows 7, XP, Vista
    Product components Gap measurement device, charging clean case, carrying suitcase, USB communications,link module and application software
    Calibration Factory recalibration recommended annually

    ◆ Applications



    • wafer fab , FPD display manufacturing
    • Mech
    • R&D institute