The WaferMate200 is a highly configurable, BOLTS-compatible robotic wafer-handling cell that mates high performance with cost competitiveness. As an ISO Class-2 clean FEOL EFEM, this platform includes all applicable mini-environment components, E84 compliance and rear hand-off.
○ Product Specifications: Pairs with all types of process tools and environments.
○ Super reliable, absolute encoder, 4-axis robots.
○ Can service up to 3 process tools.
○ 300mm automation platform, adaptable for 200mm and smaller substrates.
○ Robots fitted with range of end effector technologies, including vacuum, Bernoulli, edge grip and more.
○ Full safety guarding (OSHA and ANSI compliant).
○ FOUP Opener
○ SMIF Pod Opener
○ Aligner
○ OCR
○ Barcode
○ Ionization Bars
○ Mini Environment
○ Wafer Flip Module
○ DEK Compatible Transfer Station
○ Wafer Conveyor / Oven Interface
○ SMEMA & SECS/GEM Interfaces
| ◆Machine Specifications: | |
|---|---|
| Machine Footprint | 609mm x 1244 mm |
| Wafer Alignment |
to ± .05º |
| Wafer Placement |
±100µm |
| Clean Room Classification |
Up to ISO Class 4 (Optional) |
| Wafer Interface Option |
- SMEMA - Serial - SECS/GEM - Wafer Conveyor |
| Cassette Positions Available |
Up to 4 x 200mm Cassettes |
| MTBF |
60,000 hours |
| Full SEMI Compliance |
|
| SEMI S2, S5, CE Compliant |
|
| Uptime |
>97% |
| Handling Capabilities |
- Thin Wafers - Bonded Wafers - Warped Wafers - Perforated Wafers - Thick Wafers - Trenched Wafers - Glass Wafers |
