The WaferMate300 is a highly configurable, BOLTS-compatible robotic wafer-handling cell that mates high performance with cost competitiveness. As an ISO Class-2 clean FEOL EFEM, this platform includes all applicable mini-environment components, E84 compliance and rear hand-off.
○ Product Specifications: Pairs with all types of process tools and environments.
○ Super reliable, absolute encoder, 4-axis robots.
○ Can service up to 3 process tools.
○ 300mm automation platform, adaptable for 200mm and smaller substrates.
○ Robots fitted with range of end effector technologies, including vacuum, Bernoulli, edge grip and more.
○ Full safety guarding (OSHA and ANSI compliant).
○ FOUP Opener
○ SMIF Pod Opener
○ Aligner
○ OCR
○ Barcode
○ Ionization Bars
○ Mini Environment
○ Wafer Flip Module
○ DEK Compatible Transfer Station
○ Wafer Conveyor / Oven Interface
○ SMEMA & SECS/GEM Interfaces
◆Machine Specifications: | |
---|---|
Machine Footprint | 991”W x 1041”L x 2063”T |
Wafer Alignment |
to ± .05º |
Wafer Placement |
±100µm |
Clean Room Classification |
Up to ISO Class 2 (Optional) |
Wafer Interface Option |
- SMEMA - Transfer Station - SECS/GEM - Wafer Conveyor |
Loadport Positions Available |
1 or 2 |
MTBF |
60,000 hours |
Full SEMI Compliance |
|
SEMI S2, S5, CE Compliant |
|
Uptime |
>97% |
Handling Capabilities |
- Thin Wafers - Bonded Wafers - Warped Wafers - Perforated Wafers - Thick Wafers - Trenched Wafers - Reticles - Glass Wafers |